Tag: EE Times Asia Virtual Events

PowerUP Asia 2024 Opens Tomorrow

PowerUP Asia 2024, a two-day virtual conference focused on power semiconductor technologies and industry developments in Asia, opens tomorrow, June 11.

Organized by AspenCore, publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia builds on the success of the inaugural event last year and features keynotes and discussions on some of the latest power electronics trends, including wide-band gap (WBG) devices such as gallium nitride (GaN) and silicon carbide (SiC), power ICs, packaging, test and measurement, and related technologies.

Speaker lineup this year includes the following:

  • Collins Wu, Regional Vice President, Power & Discrete Marketing APeC Region, STMicroelectronics: Enabling High Performance Industrial and Automotive Solution with WBG
  • Alex Lidow, CEO & Co-founder of Efficient Power Conversion, Efficient Power Conversion (EPC): Why GaN for Untethered Robotics
  • Dr. Mrinal K. Das, Senior Director of Technical Marketing, onsemi: Market Dynamics of Automotive SiC Revolution for Electrification
  • Dr. Kwok Wai Ma, Senior Principal Engineer, Industrial and Consumer Power, Infineon Technologies Asia Pacific: Recent Advance and Outlook in SiC and GaN Technologies, For a Greener Future
  • Simon Keeton, Group President, Power Solutions Group, onsemi: A Pathway to Sustainable Energy: Optimized Energy Harvesting and Efficient Grid Integration
  • Michael (Hyung Mook) Choi, Vice President of Power Business, UTAC Group: Enhancing Power Semiconductor Packages for High-Performance Computing Processors
  • Bosheng Sun, Systems Engineer, Texas Instruments Inc.: A Totem-pole Bridgeless PFC with Extreme Low Ithd, Re-rush Current Control, High Power Density and Integrated E-meter Function
  • Nicholas Le Bas, Oscilloscope Product Manager and Application Engineer, Rohde & Schwarz: Measurements of Currents and High Voltages with Oscilloscopes
  • Mike Zhu, Sr. Product Applications Engineer, Qorvo Inc.: Qorvo SiC FETs Excel in ZVS Soft-switching Applications
  • Sasikala Thangam, Applications Engineer, Texas Instruments Inc.: Choosing Suitable Gate Driver Protection Approach for High Power Systems
  • Deric Waters, Systems Engineer and Distinguished Member of Technical Staff (DMTS), Texas Instruments Inc.: Power System Implications of the New USB Power Delivery 3.2
  • Jason Khor, Senior Manager, Engineering, Arrow Electronics: Optimizing Power Architectures and Designs for Next-generation Low- and High-power Applications

Panel Discussion

WBG devices have been seeing increasing adoption over the past few years, especially as manufacturers put power efficiency on top of their agenda amid the increasing trend towards decarbonization, in line with the global “net zero” goal.

As electronics and semiconductor technologies advance, businesses are creating a wide range of products that offer advantages in a number of applications for the industrial, automotive, and consumer industries, among others.

At PowerUP Asia 2024, a panel of industry experts from some of the leading companies will discuss the challenges that designers currently face, the obstacles that still need to be removed for widespread adoption of WBG devices, the latest innovations that are fueling further growth of the GaN and SiC market, and the future of the WBG industry.

With the theme The Role of GaN and SiC Technologies Towards Drive for More-Efficient Power Electronics, the panel discussion will feature the following experts:

  • Collins Wu, Regional Vice President, Power & Discrete Marketing APeC Region, STMicroelectronics
  • Alex Lidow, CEO & Co-founder of Efficient Power Conversion, Efficient Power Conversion (EPC)
  • Dr. Mrinal K. Das, Senior Director of Technical Marketing, onsemi

For more information or to register, visit https://ve.eetasia.com/powerup2024.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

PowerUP Asia 2024: Leading Power Semiconductor Companies to Discuss Challenges, Trends, and Latest Innovations

Leading power semiconductor companies including STMicroelectronics (ST), Texas Instruments Inc. (TI), Efficient Power Conversion Corp. (EPC), onsemi, Infineon Technologies Asia Pacific Pte Ltd, and NXP Semiconductors will be discussing the latest power semiconductor development trends and innovations, and how these are helping the drive toward greener electronics, at the upcoming PowerUP Asia 2024 virtual conference.

PowerUP Asia, organized by AspenCore, publisher of EETimes Asia, EETimes India, and EDN Asia, is a two-day virtual conference and exhibition focusing on power semiconductor technologies, including wide-bandgap (WBG) devices such as gallium nitride (GaN) and silicon carbide (SiC), low- and high-voltage power semiconductors, and related technologies, as electronics manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy.

With the theme Power Semiconductor Innovations Toward Green Goals, Decarbonization and Sustainability, PowerUP Asia, to be held from June 11–12, will feature keynotes, technical presentations, and a panel discussion, discussing the latest developments in power semiconductor and engineering, and how the industry can explore ways to accelerate the pathway to net-zero carbon emissions.

The virtual conference will also feature technical experts from UTAC Group, Rohde & Schwarz, Qorvo Inc., and Arrow Electronics.

Who Should Attend

Engineers, researchers, and industry professionals should attend the PowerUP Asian 2024 virtual expo and conference.

Engineers specializing in power electronics, semiconductor technologies, like GaN and SiC, and renewable energy systems will find immense value. Professionals in power management, converters and those exploring advancements in e-mobility and smart-grid infrastructure will gain significant insights.

Furthermore, those interested in gaining hands-on experience with state-of-the-art technologies within this field should attend. Those who possess a genuine enthusiasm for transforming energy efficiency, diminishing carbon footprints, and promoting the worldwide transition to renewable energy sources will find this conference to be of value.

For more information or to register, visit https://ve.eetasia.com/powerup2024.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person:
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

GaN and SiC Technologies on Spotlight at PowerUP Asia Conference

The power electronics landscape is changing. Wide-bandgap (WBG) devices, including gallium nitride (GaN) and silicon carbide (SiC), are gaining traction in replacing silicon devices, which are reaching their theoretical limits in performance, in applications including power modules and power inverters, motor drives, and chargers and adapters, to name a few.

According to Yole Developpement, the power GaN market will be worth $2 billion in 2027, with consumer applications, including power supplies and Class D audio amplifiers, representing about 48% of the total GaN industry.

In particular, the consumer power supply market for GaN is forecast to be worth over $915.6 million by 2027, growing at a compound annual growth rate (CAGR) of 52% between 2021 and 2027. For the datacom/telecom industry, Yole projects the power GaN market growth to be at 69% CAGR during the forecast period, while the GaN automotive market is expected to register a CAGR of 99%.

The SiC device market, on the other hand, is forecast to reach $6.3 billion in 2027, mainly driven by electric vehicles (EVs), their charging infrastructures, and photovoltaics, according to Yole.

WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023. Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia puts the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia.

PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.

Focusing on this region, PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including WBG devices, power semiconductors, and related technologies.

With fairgrounds, an exhibition hall, and a conference space, PowerUP Asia functions similarly to a live exhibition and conference. This technical conference will include keynotes, panel discussions, and technical presentations on significant technical trends, market demands and new application areas. Along with the conference, there will be an exhibition hall with virtual booths from top power electronics businesses and a live chat that will allow attendees to communicate directly with booth staff.

Confirmed companies presenting at the virtual conference include Analog Devices Inc., Arrow Electronics Inc., Advanced Semiconductor Engineering Inc. (ASE Group), Cambridge GaN Devices, Efficient Power Conversion Corp. (EPC), GaN Systems Inc., Infineon Technologies AG, NXP Semiconductors, Rohde & Schwarz, STMicroelectronics, and UTAC Group.

For more information and to register, visit https://ve.eetasia.com/powerup2023.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

Inaugural PowerUP Asia Conference Highlights Latest Innovations in Asia’s Power Electronics Industry

The growing electric vehicle (EV) industry, increasing calls for renewable energy adoption, the automation trends in the industrial sector, and the rising demand for consumer electronics, are fueling the growth of the power electronics industry as manufacturers set their sights on power efficiency, carbon reduction, and ‘greener’ energy.

According to research firm Global Market Insights (GMI), the worldwide power electronics market reached over $22 billion in 2022 and is expected to grow at a compound annual growth rate (CAGR) of 5.5% to reach more than $40 billion in 2032.

The Asia Pacific (APAC) region accounted for more than half of the power electronics market, recording a total market share of 55% in 2022, according to GMI, mainly driven by the increasing penetration of EVs. On top of this, the expansion of the IT sector, the growing number of Internet users, and the continuous development and rollout of 5G networks are propelling the demand for data centers in the region, which in turn is driving the demand for more power-efficient devices with higher power densities and more and more compact packages. All these are expected to transform the APAC region into a major hub for power electronics manufacturing.

To put the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia, AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, will hold the inaugural PowerUP Asia conference and virtual exhibition on May 24-26, 2023.

PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.

Focusing on this region, PowerUP Asia is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies.

With fairgrounds, an exhibition hall, and a conference space, PowerUP Asia functions similarly to a live exhibition and conference. This technical conference will include keynotes, panel discussions, and technical presentations on significant technical trends, market demands and new application areas. Along with the conference, there will be an exhibition hall with virtual booths from top power electronics businesses and a live chat that will allow attendees to communicate directly with booth staff.

Confirmed companies presenting at the virtual conference include Analog Devices Inc., Arrow Electronics Inc., Advanced Semiconductor Engineering Inc. (ASE Group), Cambridge GaN Devices, Efficient Power Conversion Corp. (EPC), GaN Systems Inc., Infineon Technologies AG, NXP Semiconductors STMicroelectronics, and UTAC Group.

For more information and to register, visit https://ve.eetasia.com/powerup2023.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person:
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com