Tag: Cnergenz Berhad

CNERGENZ Posts RM76.58 Million in Revenue for 2Q FY2022

  • Sales of integrated solutions and standalone SMT machines and equipment remained steady

CNERGENZ Berhad, an established electronics manufacturing solutions provider based in Penang, announced today that the Company recorded revenue of RM76.58 million for the second quarter ended 30 June 2022 (2QFY2022) on higher sales of standalone surface mount technology (SMT) machines and provision of integrated solutions due to continued demand from manufacturing activities in the electronics and semiconductor industries (E&S Industries). On a cumulative basis, the Company recorded revenue of RM113.48 million and net profit (PAT) of RM12.94 million for the 6-month period ended 30 June 2022.

Mr. Lye Yhin Choy, Chief Executive Officer of CNERGENZ Berhad

On a segmental basis, standalone SMT machines and equipment sales contributed 51.03% of the total revenue while provision of integrated solutions contributed 44.85% for the 2QFY2022.

Meanwhile, the Company’s profit before tax (PBT) for the 2QFY2022 had doubled to RM12.35 million as compared to the immediate preceding first quarter ended 31 March 2022 (1QFY2022) PBT of RM4.87 million. This resulted in the Company recording PAT of RM9.30 million for the 2QFY2022, which represents an increase compared to RM3.64 million recorded in the immediate preceding 1QFY2022.

Chief Executive Officer of Cnergenz, Mr. Lye Yhin Choy said, “We continue to see a steady inflow of orders in the recent quarter for our integrated solutions and standalone SMT machines and equipment in the Malaysian, Thai and Vietnamese markets where we operate despite the global headwinds that the technology sector is encountering, attributed to the gradual reopening of economies in these countries which have contributed to increased sales and new enquiries for our products and solutions. We believe that the inflow of orders will continue to grow following the recent global uptick in sales of semiconductors, particularly during the second quarter of 2022, coupled with the continued demand for our solutions and products amongst industry players within the E&S Industries.

On operational front, we have entered into a conditional sale and purchase agreement with the Penang Development Corporation for the acquisition of a parcel of industrial land in Penang. Upon completion of the acquisition, we intend to embark on the construction of our new facility by channelling our initial public offering proceeds, which will enable us to scale up our operations, develop and market a wider range of smart manufacturing solution offerings.

As of 30 June 2022, we have secured purchase orders totalling RM72.60 million, out of which RM61.16 million are expected to be fulfilled by the end of 2022 and RM11.44 million are expected to be fulfilled by the end of 2023.”

About CNERGENZ Berhad
CNERGENZ Berhad (CNERGENZ) was incorporated in Malaysia on 6 August 2021 as a private limited company under the name CNERGENZ Sdn. Bhd. and assumed the present name upon conversion to public company on 23 September 2021.

The Group is principally an investment holding company. Through its subsidiary, SiP Technology Sdn. Bhd., CNERGENZ is an electronic manufacturing solutions provider, specialising in surface mount technology (SMT) manufacturing solutions for the electronics and semiconductor industries (E&S Industries). The Group’s solutions and services are typically provided to customers who are looking to commission new integrated production lines or automate their production facilities, based on their operational requirements, budget and capital expenditure.

CNERGENZ mainly serves electronics and semiconductor companies that carry out the assembly of the advanced semiconductor packaging products as well as assembly and testing of printed circuit board assembly (PCBAs). For more information, visit cnergenz.com.

CNERGENZ Berhad Posts RM36.9 Million in Revenue for 1Q FY2022

CNERGENZ Berhad (CNERGENZ), an established electronics manufacturing solutions provider based in Penang, has announced its financial results for the first quarter ended 31 March 2022 (1QFY2022) today. The Company registered revenue of RM36.9 million for the 1QFY2022, primarily contributed from the sales of standalone surface mount technology (SMT) machines and equipment constituting 60.9% of its total revenue. In addition, sales generated from the provision of integrated solutions segment contributed 31.2% to the total revenue.

Further, the Company recorded profit before tax (PBT) of RM4.87 million and achieved net profit (PAT) of RM3.64 million for the period. After excluding one-off expenses relating to the initial public offering amounting to RM0.16 million incurred during the period, the Company’s PBT and PAT stood at RM5.03 million and RM3.80 million, respectively.

Chief Executive Officer of CNERGENZ, Mr. Lye Yhin Choy said, “Manufacturing activities remained robust in 1QFY2022 leading to the continued demand for our integrated solutions in the electronics and semiconductor (E&S) industries. We have also seen a rise in demand for smart factory solutions as customers look to automation to solve manpower woes.”

“We will continue with our plans that we have shared in the run-up to our listing, including the expansion of our facility to enable us to scale up our operations, as well as strengthening our R&D activities to develop new and innovative integrated systems and solutions to the market. To-date, we have secured purchase orders totalling RM82.48 million, which we expect to fulfil by the end of 2022.”

CNERGENZ Bhd: https://cnergenz.com
CNERGENZ Bhd: [BURSA: CNERGENZ]

CNERGENZ Berhad Lists on ACE Market, Share Price Gains 4.31% to RM0.605 on Debut

CNERGENZ Berhad (CNERGENZ), an established electronics manufacturing solutions provider based in Penang, has made its debut on the ACE Market of Bursa Malaysia Securities Berhad (Bursa Securities) under the Technology sector, opening at RM0.605 per share, which is a premium of RM0.025 or 4.31% above the IPO price of RM0.58 per share.

Ms. Yeat Soo Ching, Independent Non-Executive Director of Cnergenz; Ms. Alwizah Al-Yafii Binti Ahmad Kamal; Mr. David Lim, Chief Executive Officer of UOB Kay Hian Securities; Mr. Lye Yhin Choy, CEO & Executive Director of Cnergenz; Mr. Kong Chia Liang, COO & Executive Director; Dato’ Azman bin Mahmud, Independent Non-Executive Chairman; Mr. Lye Thim Loong, Chief Corporate Officer & Executive Director; Ms. Ooi Ley Ching, Independent Non-Executive Director [L-R]

Chairman of CNERGENZ, Dato’ Azman bin Mahmud, extended the thanks of the Company to the Securities Commission, Bursa Securities, UOB Kay Hian Securities Sdn Bhd as well as others involved in the IPO exercise, and said, “I would like to thank our investors who have placed their trust and confidence in CNERGENZ, and for their support which has contributed to the success of CNERGENZ’s IPO.”

“I am confident that CNERGENZ will continue its growth trajectory, enhancing its market presence and operations through its future expansion and development plans. We believe that the introduction of CNERGENZ to the stock exchange will bring greater visibility to investors, and highlights the importance of electronics manufacturing solutions in building up an advanced and efficient manufacturing ecosystem in the country, further strengthening Malaysia’s position as a global electronics and semiconductor hub.”

Through its IPO, CNERGENZ has successfully raised RM58.0 million in funds, which are expected to be utilised towards the Company’s facility expansion plans, research and development activities, as well as general working capital purposes.

“I would also like to thank all our suppliers, customers, investors and shareholders, who have made today’s listing a possibility and a memorable event.” Dato’ Azman bin Mahmud added.

CNERGENZ is an electronics manufacturing solutions provider, specialising in surface mount technology manufacturing solutions for the electronics and semiconductor industries. CNERGENZ’s offers its solutions, ranging from integrated solutions such as production line systems and smart factory solutions, to individual machinery, equipment and tools, to its network of over 100 customers operating within the E&S Industries, such as IDMs, OSATs, EMS and electronic products brand owners.

Based in Penang, CNERGENZ’s market base is primarily in Malaysia (save for Melaka and Johor), contributing 71.9% to the Group’s revenue in the recent financial year ended 31 December 2021, and extends to the Company’s overseas markets in Vietnam and Thailand.

UOB Kay Hian is the principal adviser, sponsor, underwriter, and placement agent for CNERGENZ’s IPO.

CNERGENZ Bhd: https://cnergenz.com
CNERGENZ Bhd: [BURSA: CNERGENZ]

CNERGENZ Berhad IPO Shares Oversubscribed by 40.32 Times

CNERGENZ Berhad (CNERGENZ) is pleased to announce that the share allocation to the Malaysian public from its IPO has been oversubscribed by 40.32 times.

Chief Executive Officer & Executive Director of CNERGENZ Berhad, Mr. Lye Yhin Choy

CNERGENZ’s IPO comprises a public issue of 100,000,000 new ordinary Shares which were made available for application in the following manner:

  • 25,000,000 Issue Shares available for application by the Malaysian Public;
  • 10,000,000 Issue Shares reserved for application by the eligible directors and employees as well as persons who have contributed to the success of the CNERGENZ group (Eligible Persons);
  • 52,750,000 Issue Shares by way of private placement to identified institutional and/or selected investors; and
  • 12,250,000 Issue Shares by way of private placement to identified Bumiputera investors approved by the Ministry of International Trade and Industry, Malaysia (MITI); and an offer for sale of 50,000,000 Offer Shares by way of private placement to identified Bumiputera investors approved by the MITI.

A total of 16,186 applications for 1,033,093,200 Issue Shares were received from the Malaysian Public, representing an oversubscription rate of 40.32 times. A total of 9,089 applications for 376,239,100 Issue Shares were received under the Bumiputera category, representing an oversubscription rate of 29.10 times, whilst a total of 7,097 applications for 656,854,100 Issue Shares were received under the other Malaysian Public category, representing an oversubscription rate of 51.55 times.

Meanwhile, the total of 10,000,000 Issue Shares available for application by the Eligible Persons were fully subscribed.

Chief Executive Officer of CNERGENZ Berhad, Mr. Lye Yhin Choy, said, “We would like to thank investors for putting their trust in us. We are extremely pleased with the reception to our IPO as it shows deep investor confidence in our business, our solutions capabilities, and the overall optimism and positive outlook of the electronics and semiconductor industry.”

Chief Executive Officer of UOB Kay Hian Securities (M) Sdn. Bhd., Mr. David Lim said, “The response to CNERGENZ’s IPO is a reflection of investors’ appetite for businesses with fundamentally strong prospects and solid growth plans. The Company is well-positioned to leverage on the continued growth and investment in the electronics and semiconductor industries in Malaysia, Vietnam and Thailand.

UOB Kay Hian, being the Principal Adviser, Sponsor, Underwriter and Placement Agent in conjunction with the IPO, has confirmed that the 52,750,000 Issue Shares by way of private placement to identified institutional and/or selected investors have been fully placed out.

The Company is expected to list on the ACE Market of Bursa Securities on 24 May 2022.

About CNERGENZ Berhad
CNERGENZ Berhad was incorporated in Malaysia on 6 August 2021 as a private limited company under the name CNERGENZ Sdn. Bhd. and assumed its present name upon conversion to public company on 23 September 2021.

The Group is principally an investment holding company. Through its subsidiary, SiP Technology Sdn. Bhd., CNERGENZ is an electronic manufacturing solutions provider, specialising in surface mount technology (SMT) manufacturing solutions for the electronics and semiconductor industries (E&S Industries). The Group’s solutions and services are typically provided to customers who are looking to commission new integrated production lines or automate their production facilities, based on their operational requirements, budget and capital expenditure.

CNERGENZ mainly serves electronics and semiconductor companies that carry out the assembly of the advanced semiconductor packaging products as well as assembly and testing of printed circuit board assembly (PCBAs). For more information, visit cnergenz.com.

For more information, please contact:
Hakim Syed Munif
Swan Consultancy Sdn Bhd
Tel: +60 12-318 5410
Email: h.juraimi@swanconsultancy.biz

CNERGENZ Berhad launches Prospectus for ACE Market IPO

Aims to raise RM58 million from listing

Cnergenz Berhad (CNERGENZ), an established electronics manufacturing solutions provider based in Penang, has launched the Company’s Prospectus today for its upcoming initial public offering (IPO) on the ACE Market of Bursa Malaysia Securities Berhad (Bursa Securities).

Mr. David Lim, Chief Executive Officer of UOB Kay Hian Securities (M) Sdn Bhd; Mr. Kong Chia Liang, Chief Operating Officer & Executive Director of CNERGENZ Berhad; Dato’ Azman bin Mahmud, Independent Non-Executive Chairman of CNERGENZ Berhad; Mr. Lye Yhin Choy, Chief Executive Officer & Executive Director of CNERGENZ Berhad; Mr. Lye Thim Loong, Chief Corporate Officer & Executive Director of CNERGENZ Berhad [L-R]

Applications for the IPO have opened starting at 10.00 a.m. today following the Prospectus launch and will close on 11 May 2022. The targeted IPO listing date of the Company on the ACE Market is on 24 May 2022. At the IPO price of RM0.58 per share, CNERGENZ will have a market capitalisation of RM288.84 million ahead of its debut.

The IPO involves the public issue of 100.0 million issue shares and an offer for sale of 50.0 million offer shares by way of private placement at the IPO price of RM0.58 per share. From the public issue, 25.0 million issue shares will be made available for application to the Malaysian public, 10.0 million shares will be allocated for application by eligible directors and employees as well as persons who have contributed to the success of CNERGENZ Group, 52.75 million shares will be reserved for private placement to identified investors and 12.25 million shares will be reserved for private placement to identified Bumiputera investors approved by the Ministry of International Trade and Industry, Malaysia (MITI).

The IPO is expected to raise gross proceeds of RM58.0 million and shall primarily be channelled towards the Group’s expansion of its operational facility, as well as research and development expenditure and working capital purposes.

CNERGENZ is an established electronics manufacturing solutions provider specialising in surface mount technology (SMT) catering to the electronics and semiconductor industries (E&S Industries) in Malaysia, Thailand and Vietnam. The Group has an established track record in providing integrated solutions that suit the evolving nature and changing technological landscape of the E&S Industries since the commencement of its business in 2004.

Chief Executive Officer of CNERGENZ Berhad, Mr. Lye Yhin Choy, said, “We are elated to have reached a new milestone with the Prospectus launch today, bringing us a step closer towards becoming a listed entity on the ACE Market of Bursa Securities. Having been in the E&S space since 2004, our listing is in line with our growth plans and strategies to scale up our operations, expand our integrated solutions and smart factory solutions offerings and develop our own proprietary range of solutions.”

Chief Executive Officer of UOB Kay Hian Securities (M) Sdn. Bhd. (UOB Kay Hian), Mr. David Lim said, “We are pleased that the interest among institutional and selected investors, as well as MITI Bumiputera institutional and individual investors have been encouraging with many indicating strong interest to subscribe for the IPO.”

UOB Kay Hian is the principal adviser, sponsor, underwriter, and placement agent for CNERGENZ’s IPO.

CNERGENZ Bhd: https://cnergenz.com
CNERGENZ Bhd: [BURSA: CNERGENZ]

Electronics Manufacturing Solutions Provider Cnergenz Berhad Enlists UOB Kay Hian Securities as Underwriter for Its Listing Exercise

Company inks underwriting agreement for ACE Market IPO

Cnergenz Berhad (Cnergenz or the Company), an electronics manufacturing solutions provider based in Penang, specialising in surface mount technology (SMT) catering to the electronics and semiconductor industries (E&S Industries), is pleased to announce that the Company has entered into an underwriting agreement with UOB Kay Hian Securities (M) Sdn. Bhd. (UOB Kay Hian) today for its upcoming initial public offering (IPO) on the ACE Market of Bursa Malaysia Securities Berhad (Bursa Securities).

UOB Kay Hian Securities Sdn. Bhd Chief Executive Officer Mr. David Lim; Cnergenz Berhad Chief Executive Officer Mr. Lye Yhin Choy [L-R]

The Company had obtained approval to list on the ACE Market of Bursa Securities and is targeting to launch its Prospectus in April 2022.

The IPO exercise involves the public issue of 100.0 million issue shares and an offer for sale of 50.0 million offer shares by way of private placement.

From the public issue, 25.0 million issue shares will be made available for application to the Malaysian public, 10.0 million shares will be allocated for application by eligible directors and employees as well as persons who have contributed to the success of Cnergenz Group (“Group”) (“Eligible Persons”), 52.75 million shares will be reserved for private placement to identified investors and 12.25 million shares will be reserved for private placement to identified Bumiputera investors approved by the Ministry of International Trade and Industry (“MITI”).

UOB Kay Hian will underwrite an aggregate of 35.0 million issue shares, comprising 25.0 million shares under the public issue and 10.0 million shares allocated to Eligible Persons as part of the underwriting agreement.

Chief Executive Officer of Cnergenz, Mr. Lye Yhin Choy, said, “This listing will enable us to strengthen our name as a leading electronics manufacturing solutions provider in Malaysia whilst deepening our presence in Thailand and Vietnam, countries which are benefitting from strong investment flows into the E&S Industries.”

Chief Executive Officer of UOB Kay Hian, Mr. David Lim said, “UOB Kay Hian is pleased to be working with Cnergenz on its IPO exercise. The Company has a stellar track record and experience in the E&S Industries that dates back to 2004. We are happy to work with Cnergenz in achieving its listing goals.”

Cnergenz collaborates closely with its network of over 50 suppliers to offer quality solutions for their customers, building a strong network and contributing to Cnergenz’ business development and growth.

Cnergenz caters to domestic and international customers across Malaysia, Vietnam and Thailand. Cnergenz has a customer base of over 100 local and multinational companies operating within the E&S Industries, comprising integrated design manufacturers (IDMs), outsourced semiconductor assembly and test service providers (OSATs) and electronics manufacturing service providers (EMSs), some of which have been customers of Cnergenz for over 15 years.

Cnergenz Berhad: https://cnergenz.com/