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Innovation Takes Center Stage at the 2024 EE Awards Asia Ceremony

Celebrating Excellence of all “EE Professionals”! The 2024 EE Awards Asia Honors Innovation and Talent

The premier annual event for Taiwan and Asia’s electronics industry, EE Awards Asia 2024, took center stage on December 5 at the GRAND HILAI TAIPEI. Organized by ASPENCORE’s Taiwan/Asia team, representing the globally influential EE Times and EDN brands, this fourth edition of the EE Awards Asia continues to advance its mission: “Shaping the Future with the Electronics Industry; Transforming the World with Engineers!” The event gathered professionals from industry, academia, and research across the region to celebrate outstanding achievements and honor the innovators behind the electronics sector—the engineers, or “EE Professionals.”

From left: EE Times/EDN Asia Editor Stephen Las Marias, Himax Optoelectronics Co-founder and CEO Wu Bingchang, Power Semiconductor Chairman Huang Chongren, EE Times/EDN Taiwan General Manager Wu Chongyi, National Development Commission Deputy Chairman Zhan Fangguan, Dr. Chenming Hu, Qiu Zhenxiang, former CEO of Nangang IC Design Incubation Center, Jiang Xuzheng, special consultant of the Institute of Green Energy and Environment of ITRI, Liao Ronghuang, leader of ITRI’s Industrial Service Center

This year’s EE Awards Asia attracted over 400 submissions from nearly 170 companies worldwide, competing across 36 categories, including Company Awards, Product Awards, Technology Platform Awards, Innovation Awards, and Analyst Awards. Since online voting opened in early August, the event has engaged nearly 10,000 readers from Taiwan and the Asia-Pacific region, reflecting a strong and enthusiastic response.

Grace Wu, General Manager of EE Times/EDN Taiwan for the Asia-Pacific region, stated: “Through this event, we aim to connect the local industry with global technology communities, inspire the next generation of engineers and attract talent to the electronics sector, while fostering a platform for technical exchange and knowledge transfer. Just as Chinese Taipei national baseball team showcased resilience to win the WBSC Premier12 championship and making the world see Taiwan, ASPENCORE will continue to elevate Taiwan & Asia electronics industry on the global stage through EE Awards Asia.”

Honoring Excellence: Celebrated Leaders and Innovators

The Executive of the Year and Outstanding EE Professional awards, selected by ASPENCORE’s global editorial team, remain the most prestigious highlights each year. These accolades recognize leaders and engineers who have driven industry progress and technological innovation.

This year’s Executive of the Year was presented to Frank Huang, Chairman of PSMC, and Jordan Wu, CEO of Himax Technologies. Under Huang’s visionary leadership, PSMC was successfully transformed into a foundry, restoring the company to glory. He also pioneered PSMC’s entry into the challenging Indian market, expanding Taiwan’s semiconductor presence. Meanwhile, Wu’s keen market insights have positioned Himax as a global leader in automotive displays and AIoT, earning a spot among the top 10 IC design companies worldwide in 2021. Both leaders exemplify excellence in guiding teams to achieve technological breakthroughs and market success.

The Outstanding EE Professional award was conferred on two renowned innovators in the field of R&D. Dr. Chenming Hu, an Academician of Academia Sinica and Honorary Professor at UC Berkeley, is celebrated as the “Foreseer of Microelectronics” for his pioneering contributions to 3D FinFET technology, pushing the boundaries of semiconductor innovation. Similarly, Dr. Kai-Sheng Chou, CEO of MEET International, leveraged his deep expertise in wireless communication, fiber optics, and networking protocols to build a successful electronic testing equipment manufacturing company. Their groundbreaking contributions set a high standard for engineering excellence and industry development.

Announcing the Winners of EE Awards Asia 2024

The Corporate Awards recognized outstanding companies in automotive electronics, AIoT, and electronic components distribution, while the Product Awards spotlighted the most favored ICs, products, and solutions across categories such as RF/Wireless, MCU/Driver IC, Power Management IC/Semiconductors, EDA, IP/Processors, Memory, Security, Test & Measurement (T&M), Sensors, AI, Passive Components, and Development Kits.

The Innovation Awards highlighted the most promising startups and innovation/R&D teams. This year also introduced new categories, including Analyst Awards and Technology Platforms Awards for Smart Manufacturing, Cybersecurity, AI, Cloud Computing, and Networking. These new additions provided an opportunity to recognize the year’s best tools and platforms as chosen by engineering professionals.

The award-winning entries across Corporate, Product, Innovation, and Technology Platform categories reflect the hottest industry trends and company strengths. This year’s surveys revealed AI as a dominant force across industries, with RISC-V and 3D IC technology garnering significant attention. Additionally, AI PCs, Edge AI, and Generative AI emerged as the most discussed and impactful innovations in the electronics sector.

Fostering Innovation and Celebrating Achievements

The 2024 EE Awards Asia series has concluded successfully, thanks to the enthusiastic participation of engineers from Taiwan and the Asia-Pacific region. Special appreciation goes to the industry partners for their strong support, including Cadence, GigaDevice, MEET International, MetaAge, Mouser Electronics, MSquare Technology, Nuvoton Technology, NXP, Texas Instruments (TI), TÜV NORD Taiwan, and Vicinity Technologies.

We eagerly look forward to the 2025 edition, where we will continue to celebrate technological innovation and collaborative achievements. For the complete list of winners and technical highlights, please refer to the attachment at the end of this article and join us in recognizing the brilliance of the 2024 EE Awards Asia!

EE Awards Asia official website: https://site.eettaiwan.com/events/eeaward2024/index.html

EE Master Forum: https://site.eettaiwan.com/events/eeaward2024/summit.html

Complete list of winners: https://site.eettaiwan.com/events/eeaward2024/index.html

News information area (photos): https://aspencore.pse.is/3rggj7

For more information, visit https://aspencore.com

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

We reach over 15 million technologists, designers, engineers, and managers. We connect this electronics community to reliable news, authoritative analysis, industry trends, and daily information on new technology.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

Contact Person
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222E: celia.shih@aspencore.com

PowerUP Asia 2024: Power Semiconductor Innovations Toward Green Goals

The continuous drive toward decarbonization is fueling power semiconductor innovations—whether in terms of materials, chip design, circuit topologies, or packaging. The need to improve and enhance energy efficiency, one of the most demanding challenges of power electronics, to meet the requirements imposed by international standards and to reduce power waste, is expected to lead to more sustainable electronics products and systems.

PowerUP Asia 2024 is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics, including wide-bandgap (WBG) devices, power semiconductors, and related technologies, as manufacturers worldwide set their sights on power efficiency, carbon reduction, and greener energy. Organized by

Now on its second year, PowerUP Asia, to be held from May 21–23, 2024, will bring the latest developments in power semiconductor and engineering, and how the industry can explore ways to accelerate the pathway to net-zero carbon emissions.

Who Should Attend

Engineers, researchers, and industry professionals should attend the PowerUP Asian 2024 Virtual Expo and Conference.

Engineers specializing in power electronics, semiconductor technologies, like GaN and SiC, and renewable energy systems will find immense value. Professionals in power management, converters and those exploring advancements in e-mobility and smart-grid infrastructure will gain significant insights.

Furthermore, those interested in gaining hands-on experience with state-of-the-art technologies within this field should attend. Those who possess a genuine enthusiasm for transforming energy efficiency, diminishing carbon footprints, and promoting the worldwide transition to renewable energy sources will find this conference to be of value.

Call for Papers

EE Times Asia is seeking papers for presentation at the upcoming PowerUP Asia 2024. Main conference topics include:

Wide-bandgap semiconductors

GaN devices
SiC devices
Packaging
Measurement and control
Automotive, industrial and consumer applications
Other materials

Power converters and related technologies

Semiconductors
Thermal management
Voltage/current, sensors
DC/DC, AC/DC, AC/AC converters, and inverters
Battery management systems
Applications

Motion control

Drivers and sensors
Electric motors
Semiconductors
Tools
Applications

Tools/test and measurement

Software
Instrumentation
Modules

Power management

Wireless power transfer
Energy harvesting
Supercapacitors and batteries
Modules and systems

All submissions (title and abstract) received by the deadline of March 29, 2024, will be assigned for editorial review, with related communication for acceptance. Please submit your proposals to Stephen Las Marias at Stephen.LasMarias@aspencore.com.

For interested companies, we are offering sponsorship packages to generate leads, raise brand awareness and participate in the conference and exhibition. For more details on sponsorship opportunities, please contact Michael Sun at Michael.Sun@aspencore.com.

Electronics Asia Conference 2023 to Highlight IoT, AI/ML, Automotive, and Wireless Developments Driving Semiconductor Industry Growth in Asia

Following the success of its inaugural edition, the second Electronics Asia Conference (EAC), a virtual conference and exhibition organized by AspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023. With the theme “Strengthening Asia’s Semiconductor Manufacturing Ecosystem,” EAC 2023 aims to highlight the latest technology trends, innovations, and strategic insights within the electronics and semiconductor industry in Asia.

This image has an empty alt attribute; its file name is EAC-2023-HERO.jpg

The global semiconductor industry reversed its five straight quarters of decline by registering a 3.4% revenue growth in the second quarter of 2023, according to Omdia. Driving the turnaround are the wireless segment, the automotive electronics sector, and artificial intelligence (AI), mainly due to growing demand for generative AI and data processing chips in the server space.

According to International Data Corp. (IDC), spending on AI—including software, services, and hardware for AI-centric systems—in the Asia-Pacific region is expected to reach $78.4 billion in 2027, reflecting a shift toward adopting cutting-edge technologies to transform operations and maintain a competitive edge in a rapidly changing market.

Meanwhile, the increasing adoption of Industry 4.0 technologies is fueling the automation and digitalization trends in the industrial space, thereby stimulating demand for Internet of Things (IoT) and embedded systems, as more manufacturers embrace smarter manufacturing.

These key trends are among the many developments driving Asia’s electronics and semiconductor supply chain.

EAC 2023 will put the spotlight on technology innovations that are driving the latest developments and new applications in sectors including IoT, AI/ML, embedded systems, industrial automation, smart manufacturing, the wireless sector, and the electronics and semiconductor supply chain. The event will feature a virtual fairground, an exhibition hall, and a conference space, similar to a live exhibition and conference.

Confirmed companies presenting at the virtual conference include Arm, Applied Materials Inc., Bluetooth Special Interest Group (SIG), Cadence Design Systems Inc., Cambridge GaN Devices, Chip 1 Exchange, GaN Systems Inc., Infineon Technologies AG, Merck Electronics, Molex, Navitas Semiconductor, proteanTecs, NXP Semiconductors, MosChip Technologies Ltd, Mouser Electronics Inc., Silicon Laboratories Inc., SCHURTER Group, STMicroelectronics, Synopsys Inc., Tektronix, and Texas Instruments Inc.

For more information and to register, visit https://ve.eetasia.com/eac2023.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person:
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

PowerUP Asia 2023 Opens Tomorrow with Power Electronics Trends in Focus

The inaugural PowerUP Asia, organized by AspenCore, publisher of EETimes Asia, EETimes India, and EDN Asia, opens tomorrow with the latest power electronics topics, including wide-band gap (WBG) devices such as gallium nitride (GaN) and silicon carbide (SiC), power semiconductors, and related technologies, in focus.

With the theme Spotlight on Asia’s Power Electronics Innovations, Trends, and Developments, PowerUP Asia is a three-day virtual conference and exhibition (May 24-26, 2023) highlighting the latest technology developments, challenges, and opportunities in the power electronics sector.

PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News. Focusing on trends and innovations in this region, speakers include:

Francesco Muggeri, Vice President of Marketing & Applications, Power Discrete & Analog, APeC/China, STMicroelectronics, WBG Technologies Toward Sustainability
Alex Lidow, CEO and Co-Founder, Efficient Power Conversion (EPC), GaN Evolution – The Present and the Future
Stephen Coates, General Manager (Asia) and VP of Global Operation, GaN Systems, GaN is Pushing the Boundaries of Power Density and Efficiency
Jacky Wan, Vice President, Supplier Management & Engineering – APAC, Arrow Electronics, and Jason Khor, Senior Manager, Engineering, Arrow Electronics, Powering the Future: The Rise of Wide Bandgap Materials in Industrial, Automotive, and Renewable Energy Applications
Andrea Bricconi, Chief Commercial Officer, Cambridge GaN Devices, Powering Up the Future with GaN: Why and How GaN is Replacing Silicon in Power Conversion
Dr. Ravinder Pal Singh, Product Application Engineer, Infineon Technologies, Wide Bandgap Devices for a Greener Future
Daryl Wan, Regional Sales Director, India, ASEAN, ANZ, Analog Devices Inc., Power to Unleash Your Innovations
Mark Gerber, Sr. Director, Engineering & Technical Marketing, ASE Inc., Advanced Packaging: Enabling Greater Power Efficiency
Hyungmook Choi (Michael Choi), VP of Power Business Development, UTAC Group, Revolutionizing the Semiconductor Market: Preparing for Future Growth in Automotive, AI, and HPC with Innovative Package Development for SiC, GaN, and Silicon Devices
Gabriel Rojas, Application Engineer, Rohde & Schwarz, Best Practice on Probing with High Voltage Differential Probes
Alvin Tan, Senior Marketing Manager, NXP Semiconductors, NXP EVSE Solutions for the Future

Spotlight on WBG

The WBG market has experienced expansion and rising industrial acceptance. As technology advances, businesses are creating a wide range of products that offer advantages in a number of applications for the industrial, automotive, and consumer industries, among others. Devices such as GaN and SiC are supplying the market with the proper input by offering fresh solutions to the challenges that designers confront in an era where “efficiency” is the watchword.

At PowerUP Asia, a panel of industry experts from some of the leading companies focusing on GaN and SiC technologies will discuss the challenges that engineers currently face in a variety of application contexts, as well as the obstacles that still need to be removed for widespread adoption, to produce improved performance and lower costs that will benefit the industry as a whole.

With the theme “Recent Advances and Upcoming Challenges for Wide Bandgap Semiconductors,” the panel discussion will be moderated by Eng. Maurizio Di Paolo Emilio, Ph.D., Editor-in-Chief of Power Electronics News and EEWeb, will feature the following panelists:

Andrea Bricconi, CCO, Cambridge GaN Devices
Thierry Bouchet, CEO, Wise Integration
Stephen Coates, General Manager (Asia) and VP of Global Operation, GaN Systems Inc.
Amitava Das, Co-Founder & COO, Tagore Technology
Pete Losee, Director of Technology Development, Qorvo Inc.
Francesco Muggeri, Vice President of Marketing & Applications, Power Discrete & Analog, APeC/China, STMicroelectronics

For more information and to register, visit https://ve.eetasia.com/powerup2023.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

Our brands include EE Times, Electronic Products, EPSNews, ESM China, IoT Times, Power Electronics News, EDN, EEWeb, Electro Schematics, Elektroda.pl, Embedded.com, Planet Analog, and more.

For more information, visit https://aspencore.com.

Contact Person
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

Key Industry Players to Discuss IoT, Automotive, Wireless, and Supply Chain Trends and Opportunities at EAC 2022

Recent economic and geopolitical developments, on top of the supply chain shortages and tight inventories in some markets, have driven market watchers to reduce their forecast growth for the semiconductor industry this year. Gartner Inc., for one, reduced its earlier forecast of 13.6% global semiconductor revenue growth this year to just 7.4%.

The market research firm, however, noted that this down cycle is not new and has happened many times before. Despite the softness in the consumer market, demand remains resilient in the data center sector due to the continued investment in cloud infrastructure, while the automotive electronics sector is expected to see double-digit growth amid the increasing IC content per vehicle due to the transition to electric and autonomous cars.

Overall, the outlook remains bright for the semiconductor industry. According to industry association SEMI, global semiconductor equipment billings rose by 7% quarter-on-quarter in the second quarter this year, and by 6% year-over-year to $26.43 billion. Taiwan, China, and South Korea led the rest of the world in terms of quarterly billings.

Semiconductor companies worldwide are expected to expand their 300mm fab capacity at nearly 10% compound average growth rate from 2022 to 2025, SEMI said in its 300mm Fab Outlook to 2025 report. Mainly driving this growth is strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions.

Highlighting such trends and innovations, the inaugural Electronics Asia Conference (EAC) 2022, scheduled for October 18–20, 2022, will feature some of the leading semiconductor companies discussing new applications and markets driving the technology developments in the semiconductor industry.

Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, the three-day event will feature a virtual conference and exhibition, and will focus on the latest trends and opportunities on the Internet of Things (IoT), automotive electronics, wireless technologies, and the supply chain.

The full roster of companies presenting at the virtual conference include:

Arm
Arrow Electronics (NYSE: ARW)
Bluetooth SIG Inc.
Cadence Design Systems Inc. (NASDAQ: CDNS)
Chip 1 Exchange
Diodes Inc. (NASDAQ: DIOD)
Efinix Inc.
Fair Friend Group (FFG)
Infineon Technologies Asia Pacific Pte Ltd
Molex
MosChip Technologies (BOM: 532407)
Mouser Electronics
Nordic Semiconductor (NOD.OL)
NXP Semiconductors (NASDAQ: NXPI)
Renesas Electronics Corp.
Rohde & Schwarz
Silicon Laboratories Inc. (NASDAQ: SLAB)
SMITH
STMicroelectronics (EPA: STM) (NYSE: STM)
Texas Instruments Inc. (NASDAQ: TXN)

For more information and to register, visit https://ve.eetasia.com/EAC2022.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

For more information, visit https://aspencore.com.

Contact Person:
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com

Electronics Asia Conference 2022 Puts Spotlight on IoT, Automotive Electronics, Wireless Technologies, and the Semiconductor Supply Chain

The global semiconductor revenue is expected to reach $661 billion in 2022, up by 13.7% year-over-year, according to International Data Corp. (IDC). While industry demand was driven by the industrial and automotive industries in 2021, IDC expects 5G, consumer electronics, wireless technologies, datacenters, and wearables will continue drive demand this year.

The Asia Pacific region, which dominated the global semiconductors market in 2021, is projected to exhibit the highest growth rate from 2022 to 2028, mainly driven by the surge in the adoption of high-end devices and growing demand for consumer electronics, according to market analyst BlueWeave Consulting.

In particular, the Internet of Things (IoT) market in Asia-Pacific region (APEJ) will continue to grow this year, accelerating by 9.1% from 6.9% in 2021, according to IDC. Despite supply chain issues and geopolitical tensions, rising demand for remote operations, better network coverage, and the deployment of commercial 5G and testbeds are driving IoT adoption in the region, which in turn is expected to boost IoT spending to $436 billion in 2026, IDC notes.

And it is the ecosystem of semiconductor device makers, equipment manufacturers, and raw materials suppliers, with the support of the academe and government institutions, that are enabling these technology developments.

To put the spotlight on the key players and the latest technologies and trends in the electronics and semiconductor industry, AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, will hold the inaugural Electronics Asia Conference (EAC) 2022 on October 18–20, 2022.

The three-day event will feature a virtual conference and exhibition, highlighting the latest technology trends, innovations and developments, and strategies to help the electronics and semiconductor industry stakeholders navigate the challenges, take advantage of, and build new opportunities in the current global manufacturing landscape.

With the theme “Gearing Up for Growth: Electronics and Semiconductor Technologies Driving Industry Developments in Asia,” EAC 2022 will put the spotlight on industries and applications including IoT, wireless technologies, automotive electronics, and the supply chain.

Confirmed companies presenting at the virtual conference include Arm, Arrow Electronics Inc. (NYSE: ARW), Cadence Design Systems Inc. (NASDAQ: CDNS), Chip 1 Exchange, Infineon Technologies AG (FSE: IFX); Nordic Semiconductor (NOD.OL), NXP Semiconductors (NASDAQ: NXPI), MosChip Technologies (BOM: 532407), Mouser Electronics, Silicon Laboratories Inc. (NASDAQ: SLAB), SMITH, STMicroelectronics (EPA: STM) (NYSE: STM), and Texas Instruments Inc. (NASDAQ: TXN).

For more information and to register, visit Electronics Asia Conference (EAC) 2022.

About AspenCore

AspenCore is a unique collection of brands and products that have set the standard in meeting the demands of today’s engineers.

For more information, visit https://aspencore.com.

Contact Person:
Celia Shih
Marketing Manager
Taiwan/ASEAN Marketing and Circulation Department
T: +886 227591366 Ext. 103/222
E: celia.shih@aspencore.com