Tag: Hua Hong Semiconductor

Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions

Hua Hong Semiconductor Limited (1347.HK), a global, leading specialty pure-play foundry, announced today that it has launched a 90nm ultra-low-leakage (ULL) embedded flash (eFlash) and electrically erasable programmable read-only memory (EEPROM) process platform to meet the needs of large-capacity microcontroller unit (MCU). As a continuation of Hua Hong Semiconductor’s 0.11um ultra-low-leakage technology, the process platform provides customers with competitive differentiated and cost-effective solution with lower power consumption, suitable for applications in Internet of Things (IoT), wearables, industrial and automotive electronics, etc.

For the newly launched 90nm ULL eFlash process platform, the leakage of 1.5V core N-Type and P-Type MOS transistors reaches 0.2pA/um, effectively extending the standby time of MCU devices. The eNVM (Embedded Non-Volatile Memory) IP of this platform has unique advantages such as 100,000 to 500,000 endurance cycles and read speed reaching 30ns. The platform also features highly integrated logic which exceeds 400K gate/mm2, capable of helping customers to reduce the chip area in many ways.

The most important advantage of this process platform is the integration of the Company’s proprietary split gate NORD eFlash technology. It has the smallest cell size and smallest area embedded NOR flash IP under the 90nm process within the industry, also advantage with fewer layers of mask which helping customers to further reduce the manufacturing cost of MCU, especially large-capacity MCU products. The platform supports RF, eFlash and EEPROM.

Executive Vice President of Hua Hong Semiconductor Dr. Kong Weiran remarked, “The Company is committed to innovation and continuous optimization of differentiated technologies to provide customers with urgently needed, cost-effective process and technical services. While improving the 8-inch platform, it is speeding up the capacity expansion and technology R&D of the 12-inch production line. IoT and automotive electronics are incremental markets for MCU applications. The launch of the 90nm ultra-low-leakage eFlash technology platform further makes available more foundry options for Hua Hong Semiconductor’s MCU customers in ultra-low power consumption applications.”

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited (1347.HK) is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory (eNVM), power discrete, analog & power management, and logic & RF. Of special note is the Company’s outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. The Company is part of the Huahong Group, an enterprise group whose main business is IC manufacturing, with advanced “8+12” production line technology.

The Company presently operates three 8-inch wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2, and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 8-inch wafer capacity of approximately 180,000 wafers. The Company also operates a 12-inch wafer fabrication facility (HH Fab7) with the planned monthly capacity of forty thousand 12-inch wafers in Wuxi’s National High-Tech Industrial Development Zone. Formal incorporation of and start of operations at HH Fab7 were achieved in 2019. In the Chinese mainland, it has become a leading 12-inch semiconductor production line devoted to specialty processes and is the first 12-inch foundry devoted to power discrete semiconductors.

For more information, please visit: www.huahonggrace.com

Hua Hong Semiconductor Relies on “8-inch + 12-inch” Strategy to Accelerate Development in IGBT Market

Hua Hong Semiconductor Limited (“Hua Hong Semiconductor” or the “Company”, stock code: 1347.HK), a global, leading specialty pure-play foundry, announced that it will fully cooperate with IGBT (Insulated Gate Bipolar Transistor) product customers to shape the IGBT ecosystem. So far, the IGBT chips with market competitiveness manufactured by the Company have been rapidly introduced into the markets of new energy vehicles, wind power generation, white smart home appliances, etc., further enriching the IGBT product line and offering a new business growth opportunity to the Company.

IGBT is the core device of energy conversion and transmission, known as “CPU of Power Electronics Industry”. As the concepts of Internet of Things (IoT) and low carbon are becoming increasingly popular, the demand for green energy and smart, variable frequency home appliances has become unstoppable and will continue to spur the rapid growth of IGBT market.

As the world’s first 8-inch foundry to provide technology for volume production of Field Stop (FS) IGBT, Hua Hong Semiconductor has profound experience in IGBT manufacturing, and has already reached the world-leading level in terms of turn-on voltage drop, turn-off loss, work safety zone and reliability. The Company has the advanced full set of IGBT thin wafer BGBM (Backside Grinding / Backside Metallization) processing technology. Hua Hong Semiconductor offers a wide range of mass-produced IGBTs, with voltages ranging from 600V to 1,700V and currents ranging from 10A to 400A, and has expanded its product portfolio from consumer products to industrial/commercial uses, new energy vehicles, etc. In addition to efforts towards higher power density and lower power loss required for high-voltage power devices, the Company is developing intelligent IGBT technology with on-chip sensors and highly reliable IGBT technology with a new thermal dissipation feature to better serve the growing demand for IGBT products in the global market.

Executive Vice President of Hua Hong Semiconductor Mr. Fan Heng remarked, “Hua Hong Semiconductor has the first 12-inch foundry devoted to power discrete semiconductors in the Chinese mainland and relies on the “8-inch +12-inch” strategy to offer a wider range of differentiated technologies and more adequate capacity. In recent years, the Company has been aiming at medium- and high-end markets and emerging fields to fully develop IGBT business, and has continuously engaged first-class IGBT product companies at home and abroad to cover application fields such as industry, automotive electronics and white goods, so as to secure its leading position in IGBT foundry. As its IGBT technology R&D is progressing well at 12-inch production line, the Company is expected to provide more competitive IGBT foundry solutions for global customers in the future.”

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited (“Hua Hong Semiconductor”, stock code: 1347.HK) (the “Company”) is a global, leading pure-play foundry with specialty process platforms uniquely focused on embedded non-volatile memory (“eNVM”), power discrete, analog & power management, and logic & RF. Of special note is the Company’s outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. The Company is part of the Huahong Group, an enterprise group whose main business is IC manufacturing, with advanced “8+12” production line technology.

The Company presently operates three 8-inch wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2, and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 8-inch wafer capacity of approximately 180,000 wafers. The Company also operates a 12-inch wafer fabrication facility (HH Fab7) with the planned monthly capacity of forty thousand 12-inch wafers in Wuxi’s National High-Tech Industrial Development Zone. Formal incorporation of and start of operations at HH Fab7 were achieved in 2019. In the Chinese mainland, it has become a leading 12-inch semiconductor production line devoted to specialty processes and is the first 12-inch foundry devoted to power discrete semiconductors.

For more information, please visit: www.huahonggrace.com